canon
Language MENU
 
  • Vision
  • Our Business
  • Newsroom
  • About Canon Machinery
  • Maintenance and Support Information
  • Contact Us
50th Canon Machinery since1972
ZH简体中文JA日本語ENEnglish
  • Vision

    This section introduces Canon Machinery’s corporate philosophy and its vision for continuing to shine in the 21st century.

    LEARN MORE
    • President’s Message
    • Corporate Philosophy & Management Philosophy
  • Our Business

    Here we introduce Canon Machinery’s areas of business: the Factory Automation System Business, the Semiconductor System Business, New Fields and Research and Development.

    LEARN MORE
    • Business Overview
    • Factory Automation System Business
    • Semiconductor System Business
  • Newsroom

    Here, we provide the latest news about Canon Machinery.

    LEARN MORE
    • April 23, 2025 Notice of Golden Week Holiday Closure
    • April 1, 2025 Notice Change of Representative Directors and Officers
    • December 17, 2024 Notice of Year-End and New Year's Holidays Closure
    • November 5, 2024 Notice regarding liquidation of subsidiary
    • August 7, 2024 Discontinued Parts for Maintenance Service
    • July 31, 2023 Notice of Summer Closure
  • About Canon Machinery

    In addition to corporate information on Canon Machinery, this section provides technology, product and introduces CSR activities.

    LEARN MORE
    • Corporate Info
    • Corporate Profile
    • Canon Machinery Operations
    • Technology
    • Machinery Movie
    • Official Social Media Account Lists
    • Product Information
    • CSR Activities
    • Environmental Initiatives
    • Quality and Safety Initiatives
    • Risk Management
    • Social Contribution Activities
  • TOP
  • Vision
    • Back
    • Vision
    • President’s Message
    • Corporate Philosophy & Management Philosophy
  • Our Business
    • Back
    • Our Business
    • Business Overview
    • Factory Automation System Business
    • Semiconductor System Business
  • Newsroom
  • About Canon Machinery
    • Back
    • About Canon Machinery
    • Corporate Info
      • Back
      • Corporate Profile
      • Canon Machinery Operations
    • Technology
      • Back
      • Technology
      • Unique Technology presently supporting Canon Machinery
    • Machinery Movie
    • Official Social Media Account Lists
    • Product Information
      • Back
      • Product Information
      • Semiconductor-related Products
        • Back
        • Semiconductor-related Products
        • 8-Inch Series Platform
          • Back
          • 8-Inch Series Platform
          • BESTEM-D310/D311plus
          • BESTEM-D320
          • BESTEM-D340
          • BESTEM-C310
          • BESTEM-S300
          • Needleless Pickup Unit
        • 12-Inch Series Platform
          • Back
          • 12-Inch Series Platform
          • BESTEM-D610
          • BESTEM-D511 plus
          • BESTEM-D511fplus
          • BESTEM-D540
          • BESTEM-D631
          • BESTEM-S500
          • Needleless Pickup Unit
        • Inspection System
          • Back
          • BESTEM-V110
        • In Line Curing Oven
          • Back
          • BCOS-Ⅵ
      • Electronic Components-related Products
        • Back
        • Electronic Components-related Products
        • Substrate coining device
          • Back
          • HPM-44000
          • HPM-13000A
        • Substrate cutting device
          • Back
          • SDM-300T
      • Maintenance and Support Information
        • Back
        • Maintenance and Support Information
        • For Discontinued and Replacement Prats
    • CSR Activities
      • Back
      • Environmental Initiatives
      • Quality and Safety Initiatives
      • Risk Management
      • Social Contribution Activities
  • Maintenance and Support Information
  • Contact Us
Semiconductor-related Products
Open
  • Product Information
  • For Semiconductor-related Products
    • Back
    • For Semiconductor-related Products
    • 8 inch Series Platform
      • Back
      • 8 inch Series Platform
      • BESTEM-D310/D311plus
      • BESTEM-D320
      • BESTEM-D340
      • BESTEM-C310
      • BESTEM-S300
      • Needleless Pickup Unit
    • 12 inch Series Platform
      • Back
      • 12 inch Series Platform
      • BESTEM-D610
      • BESTEM-D511 plus
      • BESTEM-D511fplus
      • BESTEM-D540
      • BESTEM-D631
      • BESTEM-S500
      • Needleless Pickup Unit
    • Inspection equipment
      • Back
      • BESTEM-V110
    • Inline curing oven
      • Back
      • BCOS-Ⅵ
  • For Electronic Components-related Products
    • Back
    • For Electronic Components-related Products
    • Substrate coining device
      • Back
      • HPM-44000
      • HPM-13000A
    • Substrate cutting device
      • Back
      • SDM-300T
  • For Maintenance and Support Information
    • Back
    • For Maintenance and Support Information
    • For Discontinued and Replacement Prats

BESTEM-V110

BESTEM-V110
  • Overview
  • Specifications

Basic Information

Model name: BESTEM-V110

This model is 3D AOI machine to achieve more automated and efficient inspection required by Wire bonding process.

Features

1.High Performance 3D Measurement
Equipped with 3D measurement function utilizing the focal point method. Compared to other 3D measurement methods, this method is distinctive for its strength in measuring inclined surfaces and microstructures, facilitating appearance inspections with fewer false positives.

2.Highly Reliable Inspections via Dimension Measurements
Capable of measuring various dimensions, such as the apex of wire height and bond width. A standard range is set for the dimensions of each part, facilitating rejections when dimensions falls outside the specified range.

3.Traceability Support
Measurement results can be saved internally and then output externally.
By analyzing the result of each measurement, it is possible to apprehend assembly variations and trends useful for improving the upstream process.

4.Easy Operation
Inspections are easily conducted by simply selecting the name of the product to be inspected and indicating inspection start. Automatic supply and discharge of materials is possible via the loader/unloader.

Main Specs

Inspection Objects
Wire height, Wire-Chip clearance, Wire bend, Bond width, etc.
Compatible Bonding Type
Wedge, ball, clip
Compatible Wire Diameter
17 – 400 μm
Measurement Repeatability (3σ)
Vertical : 2.0 μm, Horizontal : 5.0 μm
Compatible Material Size
Height: 4.0 mm or less
Min: W 20 mm × L 100 mm
Max: W 100 mm × L 260 mm
Power requirements
200-240V AC, 50/60 Hz, 20A
Compressed Air
0.4 MP or above, 50 L/min or higher
Vacuum source
100 L/min or more, -66.7 kPa or less
External Dimensions
W: 1,955 mm × D: 985 mm × H: 1,680 mm
(not including signal tower)
Weight
Approximately 900 kg

Options

Code Reader
QR code, DataMatrix
Traceability Function
Automated transmission of inspection history to external server

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.

  • TOP
  • About Canon Machinery
  • Product Information
  • Semiconductor-related Products
  • BESTEM-V110
Site Map  |  Contact Us  |  Terms of Use  |  Privacy Notice
© Canon Machinery Inc.
ページトップへ