Epoxy Die Bonder

Epoxy Die Bonder BESTEM-D310
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-D310

High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI


1.Best TCO
Small footprint, shorter product switching time

2.Best Quality
Quick-drying paste compatibility.

3. Wide range of lead frame compatibility
Lead frame size: W 102 mm × L 300 mm.

4.Equipped with newly developed twin dispensing system
Compatible with a variety of pastes, stable application performance.

5.High-accuracy small die pickup
□0.15–8.0 mm compatibility.

Main Specs

Bonding Method
Epoxy bonding
Bonding Speed
Bonding Accuracy
XY : ±25μm,3σ
θ : ±1°,3σ(□1.0mm or above)
θ : ±3°,3σ(under □1.0mm)
Die Size
□0.3-□8.0mm t=0.1-0.5mm
Option : □0.15-□2.0mm
Lead frame Size
Length : 50-260mm(up to 300 mm in option)
Width : 20-102mm
Thickness : 0.1-1.0mm
Magazine Size
Length : 50-260mm(up to 300 mm in option)
Width : 20-110mm
Thickness : 50-200mm
Pitch : 3mm-
Wafer Size
Max φ8 inch
Power requirements
Power supply: AC 200 V / 20 A
Dry air: 0.4 MPa (60 L/min)
Vacuum: -66.7 KPa (100 L/min)
(W) 1,600 × (D) 1,130 × (H) 1,630mm
(without signal tower when front cover is closed)
Approximately 1,200 kg


Optional Functions
Magazine stacker loader
Ionizer blower
Needleless pickup
Wafer mapping