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Epoxy Die Bonder
BESTEM-D320

Epoxy Die Bonder BESTEM-D320
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-D320

Die bonder with twin transfer (stamping) tools for 8 inch wafer LEDs.

Features

1. Equipped with a twin stamping tool system to improve productivity

2. Achieves high quality by minimizing the distance between bond application and chip mounting to suppress changes in the adhesive over time

3. Able to apply to various type of island patterns

4. Equipped with wizard functionality to realize excellent operability

Main Specs

Bonding Method
Epoxy bonding
Coating unit
Twin-stamper method
Bonding Speed
0.185sec/cycle
*Not including processing time
Bonding Accuracy
XY: ±38 μm, 3 σ
θ: ±3°, 3 σ
Die Size
□0.1-□1.5 mm
Lead frame size
(substrate size)
Length: 50-260 mm
(as an option, supports up to 300 mm)
Width: 20-100 mm
Thickness: 0.1-1 mm
(as an option, supports up to 3 mm)
Wafer Size
Max φ8 inch
Power requirements
Power requirements: AC200V 20A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7KPa (100L/min)
Dimensions
(W) 1,860 × (D) 1,282 × (H) 1,622mm
(without signal tower when front cover is closed)
Weight
Approximately 1,500 kg

Options

Optional Functions
1. Support for ring change
2. Support for ring elevators
3. Support for expanders

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.