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Epoxy Die Bonder BESTEM-D320
- Overview
- Specifications
Basic Information
Model name : BESTEM-D320
Die bonder with twin transfer (stamping) tools for 8 inch wafer LEDs.
Features
1. Equipped with a twin stamping tool system to improve productivity
2. Achieves high quality by minimizing the distance between bond application and chip mounting to suppress changes in the adhesive over time
3. Able to apply to various type of island patterns
4. Equipped with wizard functionality to realize excellent operability
Main Specs
- Bonding Method
- Epoxy bonding
- Coating unit
- Twin-stamper method
- Bonding Speed
- 0.185sec/cycle
*Not including processing time
- Bonding Accuracy
-
XY: ±38 μm, 3 σ
θ: ±3°, 3 σ
- Die Size
- □0.1-□1.5 mm
- Lead frame size
(substrate size) -
Length: 50-260 mm
(as an option, supports up to 300 mm)
Width: 20-100 mm
Thickness: 0.1-1 mm
(as an option, supports up to 3 mm)
- Wafer Size
- Max φ8 inch
- Power requirements
-
Power requirements: AC200V 20A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7kPa (100L/min)
- Dimensions
- (W) 1,860 × (D) 1,282 × (H) 1,622mm
(without signal tower when front cover is closed)
- Weight
- Approximately 1,500 kg
Options
- Optional Functions
-
1. Support for ring change
2. Support for ring elevators
3. Support for expanders
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.