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Die SorterBESTEM-S300
- Overview
- Specifications
Basic Information
Model name : BESTEM-S300
Die sorter for tray storage compatible with up to 8-inch wafers.
Features
1. Equipped with a tray pocket recognition function to improve tray arrangement accuracy
2. Best TCO - High UPH, Small footprint, shortening device conversion time ‒
3. Equipped with a needless pickup unit (optional) for compatibility with thin chips
Main Specs
- Bonding Method
- No bonding
- Bonding Speed
-
0.6sec/cycle
*Not including processing time
- Bonding Accuracy
-
XY: ±38 µm (3 σ)
θ: ±0.5° (3 σ) (□2.0 mm or above)
±1.0° (3 σ) (Less than □2.0 mm)
- Die Size
-
□1.0-10 mm
t: 0.1-1.0 mm
- Lead frame size
(substrate size) -
□2” tray, Fluoroware or equivalent: 50.4 mm
□3” tray, Fluoroware or equivalent: 76.2 mm
□4” tray, Fluoroware or equivalent: 101.6 mm
- Wafer Size
- Max φ8 inch
- Power requirements
-
Power requirements: AC200V 20A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7kPa (100L/min)
- Dimensions
-
(W) 1,400 × (D) 1,260 × (H) 1,680mm
(without signal tower when front cover is closed)
- Weight
- Approximately 1,200 kg
Options
- Optional Functions
-
1. Needleless pickup
2. Glass chip visual inspection function
3. Wafer mapping
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.