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Die Sorter
BESTEM-S300

Die Sorter BESTEM-S300
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-S300

Die sorter for tray storage compatible with up to 8-inch wafers.

Features

1. Equipped with a tray pocket recognition function to improve tray arrangement accuracy

2. Best TCO - High UPH, Small footprint, shortening device conversion time ‒

3. Equipped with a needless pickup unit (optional) for compatibility with thin chips

Main Specs

Bonding Method
No bonding
Bonding Speed
0.6sec/cycle
*Not including processing time
Bonding Accuracy
XY: ±38 µm (3 σ)
θ: ±0.5° (3 σ) (□2.0 mm or above)
±1.0° (3 σ) (Less than □2.0 mm)
Die Size
□1.0-10 mm
t: 0.1-1.0 mm
Lead frame size
(substrate size)
□2” tray, Fluoroware or equivalent: 50.4 mm
□3” tray, Fluoroware or equivalent: 76.2 mm
□4” tray, Fluoroware or equivalent: 101.6 mm
Wafer Size
Max φ8 inch
Power requirements
Power requirements: AC200V 20A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7KPa (100L/min)
Dimensions
(W) 1,400 × (D) 1,260 × (H) 1,680mm
(without signal tower when front cover is closed)
Weight
Approximately 1,200 kg

Options

Optional Functions
1. Needleless pickup
2. Glass chip visual inspection function
3. Wafer mapping

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.