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Epoxy High-Accuracy Die Bonder
BESTEM-D511plus

Epoxy High-Accuracy Die Bonder BESTEM-D511plus
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-D511plus

Die bonder with a single dispenser for 12-inch wafer IC·LSI

Features

1. High cleanliness (optional)

2. Support various products by adaptor plate lift up/down mechanism and island heating system option

3. Equipped with wizard functionality to realize excellent operability

4. Equipped with a needless pickup unit (optional) for compatibility with thin chips

Main Specs

Bonding Method
Epoxy bonding/thermal compression bonding (OP)
Coating unit
Single-dispenser method
Bonding Speed
0.39sec/cycle (□3.0 mm -8.0 mm)
*Not including processing time
Bonding Accuracy
XY: ±20 μm, 3 σ
θ accuracy: ±0.5° (3 σ) (□1.0 mm or more)
Die Size
□1.0 mm -20.0 mm
t: 0.025-1.0 mm
Lead frame size
(substrate size)
Length: 100-300 mm
Width: 25-102 mm
Thickness: 0.075-2.0 mm
Down set height 0-1.0 mm
Up set height 0-0.3 mm
Wafer Size
Max φ12 inch
Power requirements
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7KPa (100L/min)
Dimensions
(W) 1,900 × (D) 1,400 × (H) 1,600mm
(without signal tower when front cover is closed)
Weight
Approximately 1,600 kg

Options

Optional Functions
1. Mechanisms to raise/lower adapter plates
2. Supports mounted heater (max 200℃-3 CH)
3. Needleless pickup
4. Wafer mapping
5. Traceability

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.