DAF High-Accuracy Die BonderBESTEM‐D511f plus
- Overview
- Specifications
Basic Information
Model name : BESTEM‐D511f plus
High performance flip chip die bonder for flip chip bonding compatible with 12 inch wafers.
Features
1.Best TCO
High throughput, small footprint, shortening device conversion time, multiple dispensing head
2.Best Quality
Bonding accuracy: XY: ± 12 µm, 3σ
3.Multiple Functions
Compatible with dipping process
4.Highly Accurate Small die pickup
□0.3–□8.0 mm compatibility
5.Flexible Handling
Enables switching between flip chip bonding modes using an ON/OFF switch
Main Specs
- Bonding Method
- Flip chip bonding
- Bonding Speed
- UPH : 12,000
- Bonding Accuracy
- XY : ±12μm,3σ
- Die Size
-
□0.3-□8.0 mm t=0.075-0.5 mm
Option : □0.15-□2.0mm
- Lead frame Size
-
Length: 100~300 mm
Width: 25~102 mm
Thickness: 0.075–2.0 mm
Dimple: 0–1.0 mm
- Magazine Size
-
Length: 100~315 mm
Width: 35~115 mm
Thickness: 50–200 mm
Pitch: 3mm–
- Wafer Size
- Max φ12 inch
- Dimensions
-
(W) 1,930 × (D) 1,400 × (H) 1,600mm
(without connecting rail / duct hose, signal tower)
- Weight
- 1,600 kg