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Epoxy Flip Chip Bonder
BESTEM‐D511f plus

Epoxy Flip Chip Bonder BESTEM‐D511f plus
  • Overview
  • Specifications

Basic Information

Model name : BESTEM‐D511f plus

Flip chip die bonder for flip chip bonding compatible with up to 12-inch wafers.

Features

1. Switchable between flip chip bonding and standard chip bonding

2. Equipped with a mechanism to heat islands for compatibility with DAF bonding products

3. Equipped with a back-side recognition camera to realize high accuracy

4. Compatible with up to 12-inch wafers

Main Specs

Bonding Method
Epoxy bonding/thermal compression bonding (OP)
Coating unit
Twin-dispenser method
Bonding Speed
0.45 sec/cycle (up to □2.0 mm)
*Flip high-accuracy mode (back-side recognition ON)
Not including processing time
Bonding Accuracy
Flip mode back-side recognition ON:
･XY accuracy: ±12 μm (3 σ)
･θ accuracy:
±1.0°(3 σ) (□1.0 mm or above)
±2.0°(3 σ) (Less than □1.0 mm)
Die Size
□0.3-□8.0 mm
t: 0.075-0.5 mm
Option: □0.15-2.0 mm
Lead frame size
(substrate size)
Length: 100-300 mm
Width: 25-102 mm
Thickness: 0.075-2.0 mm
Down set height 0-1.0 mm
Up set height 0-0.3 mm
Wafer Size
Max φ12 inch
Power requirements
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7KPa (100L/min)
Dimensions
(W) 1,900 × (D) 1,400 × (H) 1,600mm
(without signal tower when front cover is closed)
Weight
Approximately 1,600 kg

Options

Optional Functions
1. Supports mounted heater (max 200℃-1 CH)
2. Needleless pickup

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.