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Epoxy Flip Chip BonderBESTEM‐D511f plus
- Overview
- Specifications
Basic Information
Model name : BESTEM‐D511f plus
Flip chip die bonder for flip chip bonding compatible with up to 12-inch wafers.
Features
1. Switchable between flip chip bonding and standard chip bonding
2. Equipped with a mechanism to heat islands for compatibility with DAF bonding products
3. Equipped with a back-side recognition camera to realize high accuracy
4. Compatible with up to 12-inch wafers
Main Specs
- Bonding Method
- Epoxy bonding/thermal compression bonding (OP)
- Coating unit
- Twin-dispenser method
- Bonding Speed
-
0.45 sec/cycle (up to □2.0 mm)
*Flip high-accuracy mode (back-side recognition ON)
Not including processing time
- Bonding Accuracy
-
Flip mode back-side recognition ON:
･XY accuracy: ±12 μm (3 σ)
･θ accuracy:
±1.0°(3 σ) (□1.0 mm or above)
±2.0°(3 σ) (Less than □1.0 mm)
- Die Size
-
□0.3-□8.0 mm
t: 0.075-0.5 mm
Option: □0.15-2.0 mm
- Lead frame size
(substrate size) -
Length: 100-300 mm
Width: 25-102 mm
Thickness: 0.075-2.0 mm
Down set height 0-1.0 mm
Up set height 0-0.3 mm
- Wafer Size
- Max φ12 inch
- Power requirements
-
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7kPa (100L/min)
- Dimensions
-
(W) 1,900 × (D) 1,400 × (H) 1,600mm
(without signal tower when front cover is closed)
- Weight
- Approximately 1,600 kg
Options
- Optional Functions
-
1. Supports mounted heater (max 200℃-1 CH)
2. Needleless pickup
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.