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Epoxy Die Bonder
BESTEM-D610

Epoxy Die Bonder BESTEM-D610
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-D610

12" wafer Die Bonder with twin dispensing system

Features

1. The accuracy has improved to ±20μm, and productivity has increased by 10% at actual production level

2. The auto compensation function to response various changes that occur during operation has made it possible to operate the system continuously for long periods of time

3. The paste writer is able to edit in a free pattern to achieve the ideal paste spread condition.

4. The new equipment includes options such as an needless pickup unit, and the UI has been refurbished to provide excellent operability

Main Specs

Bonding Method
Epoxy bonding/thermal compression bonding (OP)
Coating unit
Twin-dispenser method
Bonding Speed
UPH16,500 （chipsize:□0.5mm）
Bonding Accuracy
XY: ±20 μm, 3 σ（±15μm *conditional specification）
θ: ±1°, 3 σ (□1.0 mm or above)
θ: ±3°, 3 σ (Less than □1.0 mm)
Die Size
□0.3-□15.0 mm
t: 0.05-0.5 mm
Lead frame size
(substrate size)
Length: 100-300 mm
Width: 25-102 mm
Thickness: 0.075-2.0 mm
Down set height 0-1.0 mm
Up set height 0-0.3 mm
Wafer Size
Max φ12 inch
Power requirements
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -80kPa (100L/min)
Dimensions
(W) 2,275 × (D) 1,475 × (H) 1,680mm
(not including signal tower)
Weight
Approximately 1,650 kg

Options

Optional Functions
1. Supports mounted heater (MAX 200℃)
2. Needleless pickup
3. Wafer mapping
4. Traceability

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.