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Epoxy Die BonderBESTEM-D610
- Overview
- Specifications
Basic Information
Model name : BESTEM-D610
12" wafer Die Bonder with twin dispensing systemFeatures
1. The accuracy has improved to ±20μm, and productivity has increased by 10% at actual production level
2. The auto compensation function to response various changes that occur during operation has made it possible to operate the system continuously for long periods of time
3. The paste writer is able to edit in a free pattern to achieve the ideal paste spread condition.
4. The new equipment includes options such as an needless pickup unit, and the UI has been refurbished to provide excellent operability
Main Specs
- Bonding Method
- Epoxy bonding/thermal compression bonding (OP)
- Coating unit
- Twin-dispenser method
- Bonding Speed
- UPH16,500 （chipsize:□0.5mm）
- Bonding Accuracy
-
XY: ±20 μm, 3 σ（±15μm *conditional specification）
θ: ±1°, 3 σ (□1.0 mm or above)
θ: ±3°, 3 σ (Less than □1.0 mm)
- Die Size
-
□0.3-□15.0 mm
t: 0.05-0.5 mm
- Lead frame size
(substrate size) -
Length: 100-300 mm
Width: 25-102 mm
Thickness: 0.075-2.0 mm
Down set height 0-1.0 mm
Up set height 0-0.3 mm
- Wafer Size
- Max φ12 inch
- Power requirements
-
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -80kPa (100L/min)
- Dimensions
-
(W) 2,275 × (D) 1,475 × (H) 1,680mm
(not including signal tower)
- Weight
- Approximately 1,650 kg
Options
- Optional Functions
-
1. Supports mounted heater (MAX 200℃)
2. Needleless pickup
3. Wafer mapping
4. Traceability
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.