Vision
This section introduces Canon Machinery’s corporate philosophy and its vision for continuing to shine in the 21st century.

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- President’s Message
- Corporate Philosophy ＆ Management Philosophy

Our Business
Here we introduce Canon Machinery’s areas of business: the Factory Automation System Business, the Semiconductor System Business, New Fields and Research and Development.

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Newsroom
Here, we provide the latest news about Canon Machinery.

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- December 17, 2024 Notice of Year-End and New Year's Holidays Closure
- November 5, 2024 Notice regarding liquidation of subsidiary
- August 7, 2024 Discontinued Parts for Maintenance Service
- July 31, 2023 Notice of Summer Closure
- March 21, 2024 Discontinued Parts for Maintenance Service
- December 21, 2023 Notice of Year-End and New Year's Holidays Closure

About Canon Machinery
In addition to corporate information on Canon Machinery, this section provides technology, product and introduces CSR activities.

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- Corporate Info
- Corporate Profile
- Canon Machinery Operations
- Technology
- Machinery Movie
- Official Social Media Account Lists
- Product Information
- CSR Activities
- Environmental Initiatives
- Quality and Safety Initiatives
- Risk Management
- Social Contribution Activities

Semiconductor-related Products

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Product Information
For Semiconductor-related Products
- Back
- For Semiconductor-related Products
- 8 inch Series Platform
- 12 inch Series Platform
- Inspection equipment
  - Back
  - BESTEM-V110
- Inline curing oven
  - Back
  - BCOS-Ⅵ
For Electronic Components-related Products
- Back
- For Electronic Components-related Products
- Substrate coining device
- Substrate cutting device
  - Back
  - SDM-300T
For Maintenance and Support Information

Inline Curing Oven
BCOS-Ⅵ

Overview
Specifications

Basic Information

Model name : BCOS-Ⅵ

In-line curing device that cures chip bonding resin in an oven and stores the dies in a magazine.

Features

1. Realizes a maximum curing temperature of 400℃.

2. Supports temperature profile settings.

3. Support in-line connection with front end process equipment.

Main Specs

Temperature Range: RT–400ﾟC

Cycle Time: 8.0sec/ Lead frame MIN

Curing Time: Determined by specified profile and L/F shape

Lead frame size (substrate size): Length: 120–300 mm
Width: 16–102 mm

Temperature profile settings: Up to 20 profiles

Dimensions: (W）1,055mm（D）2,550mm（H）1,305mm

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.

Inline Curing OvenBCOS-Ⅵ