Semiconductor-related Products
Open

Inline Curing Oven
BCOS-Ⅵ

BCOS-Ⅵ
  • Overview
  • Specifications

Basic Information

Model name : BCOS-Ⅵ

In-line curing device that cures chip bonding resin in an oven and stores the dies in a magazine.

Features

1. Realizes a maximum curing temperature of 400℃.

2. Supports temperature profile settings.

3. Support in-line connection with front end process equipment.

Main Specs

Temperature Range
RT–400ﾟC
Cycle Time
8.0sec/ Lead frame MIN
Curing Time
Determined by specified profile and L/F shape
Lead frame size
(substrate size)
Length: 120–300 mm
Width: 16–102 mm
Temperature profile settings
Up to 20 profiles
Dimensions
(W）1,055mm（D）2,550mm（H）1,305mm

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.