Inline Curing OvenBCOS-Ⅵ
![BCOS-Ⅵ](img/BCOS-6.jpg)
- Overview
- Specifications
Basic Information
Model name : BCOS-Ⅵ
In-line curing device that cures chip bonding resin in an oven and stores the dies in a magazine.
Features
1. Realizes a maximum curing temperature of 400℃.
2. Supports temperature profile settings.
3. Support in-line connection with front end process equipment.
Main Specs
- Temperature Range
- RT–400゚C
- Cycle Time
- 8.0sec/ Lead frame MIN
- Curing Time
- Determined by specified profile and L/F shape
- Lead frame size
(substrate size) - Length: 120–300 mm
Width: 16–102 mm
- Temperature profile settings
- Up to 20 profiles
- Dimensions
- (W)1,055mm(D)2,550mm(H)1,305mm
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.