Canon Machinery supports manufacturing in the semiconductor fabrication market through the provision of die bonders, die sorters and inspection equipment responsible for semiconductor fabrication post-processes, high-performance, high-quality bonding equipment and semiconductor-related equipment based on elemental technologies including die pickup technologies and high-precision recognition technologies.
We will continue to pursue customer ideals using original technologies such as the “needleless pickup system” first developed by Canon Machinery.
The “needleless pickup system” first developed by Canon Machinery can pick up an ultra-thin die with a thickness of 15 microns without damaging it.
From discrete to ultra-LSI, we meet a wide-range of customer needs with proprietary Canon Machinery technologies and product lineups.
This fully automated die sorter picks up only the best quality diced wafers, arranging and storing them on a tray.
Equipped with a soft and low-vibration full-digital control bonding head, a teaching function and HMI bonding, these products contribute to production line high-productivity, safety and flexibility.
From preprocesses conducted before wafer processing to processes conducted after inspection, the production process demands high-quality management.
These products contribute to the device inspection automation and efficiency required for high reliability by visualizing unseen defects and microscopic shapes and the incorporation of image processing technologies.
Supporting a variety of customer needs with a full lineup of semiconductor-related equipment products including inline curing ovens and gang press machines.