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50th Canon Machinery since1972
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  • Vision

    This section introduces Canon Machinery’s corporate philosophy and its vision for continuing to shine in the 21st century.

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    • President’s Message
    • Corporate Philosophy & Management Philosophy
  • Our Business

    Here we introduce Canon Machinery’s areas of business: the Factory Automation System Business, the Semiconductor System Business, New Fields and Research and Development.

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    • Business Overview
    • Factory Automation System Business
    • Semiconductor System Business
  • Newsroom

    Here, we provide the latest news about Canon Machinery.

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    • April 23, 2025 Notice of Golden Week Holiday Closure
    • April 1, 2025 Notice Change of Representative Directors and Officers
    • December 17, 2024 Notice of Year-End and New Year's Holidays Closure
    • November 5, 2024 Notice regarding liquidation of subsidiary
    • August 7, 2024 Discontinued Parts for Maintenance Service
    • July 31, 2023 Notice of Summer Closure
  • About Canon Machinery

    In addition to corporate information on Canon Machinery, this section provides technology, product and introduces CSR activities.

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    • Corporate Info
    • Corporate Profile
    • Canon Machinery Operations
    • Technology
    • Machinery Movie
    • Official Social Media Account Lists
    • Product Information
    • CSR Activities
    • Environmental Initiatives
    • Quality and Safety Initiatives
    • Risk Management
    • Social Contribution Activities
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  • Vision
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    • Vision
    • President’s Message
    • Corporate Philosophy & Management Philosophy
  • Our Business
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    • Our Business
    • Business Overview
    • Factory Automation System Business
    • Semiconductor System Business
  • Newsroom
  • About Canon Machinery
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    • About Canon Machinery
    • Corporate Info
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      • Corporate Profile
      • Canon Machinery Operations
    • Technology
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      • Technology
      • Unique Technology presently supporting Canon Machinery
    • Machinery Movie
    • Official Social Media Account Lists
    • Product Information
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      • Product Information
      • Semiconductor-related Products
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        • Semiconductor-related Products
        • 8-Inch Series Platform
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          • 8-Inch Series Platform
          • BESTEM-D310/D311plus
          • BESTEM-D320
          • BESTEM-D340
          • BESTEM-C310
          • BESTEM-S300
          • Needleless Pickup Unit
        • 12-Inch Series Platform
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          • 12-Inch Series Platform
          • BESTEM-D610
          • BESTEM-D511 plus
          • BESTEM-D511fplus
          • BESTEM-D540
          • BESTEM-D631
          • BESTEM-S500
          • Needleless Pickup Unit
        • Inspection System
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          • BESTEM-V110
        • In Line Curing Oven
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          • BCOS-Ⅵ
      • Electronic Components-related Products
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        • Electronic Components-related Products
        • Substrate coining device
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          • HPM-44000
          • HPM-13000A
        • Substrate cutting device
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          • SDM-300T
      • Maintenance and Support Information
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        • Maintenance and Support Information
        • For Discontinued and Replacement Prats
    • CSR Activities
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      • Environmental Initiatives
      • Quality and Safety Initiatives
      • Risk Management
      • Social Contribution Activities
  • Maintenance and Support Information
  • Contact Us

Semiconductor System Business

Canon Machinery supports manufacturing in the semiconductor fabrication market through the provision of die bonders, die sorters and inspection equipment responsible for semiconductor fabrication post-processes, high-performance, high-quality bonding equipment and semiconductor-related equipment based on elemental technologies including die pickup technologies and high-precision recognition technologies.
We will continue to pursue customer ideals using original technologies such as the “needleless pickup system” first developed by Canon Machinery.

Die Bonders

Die Bonders

The “needleless pickup system” first developed by Canon Machinery can pick up an ultra-thin die with a thickness of 15 microns without damaging it.
From discrete to ultra-LSI, we meet a wide-range of customer needs with proprietary Canon Machinery technologies and product lineups.

Die Sorters

This fully automated die sorter picks up only the best quality diced wafers, arranging and storing them on a tray.
Equipped with a soft and low-vibration full-digital control bonding head, a teaching function and HMI bonding, these products contribute to production line high-productivity, safety and flexibility.

Die Sorters

Inspection Equipment

Inspection Equipment

From preprocesses conducted before wafer processing to processes conducted after inspection, the production process demands high-quality management.
These products contribute to the device inspection automation and efficiency required for high reliability by visualizing unseen defects and microscopic shapes and the incorporation of image processing technologies.

Other Semiconductor Fabrication Equipment

Supporting a variety of customer needs with a full lineup of semiconductor-related equipment products including inline curing ovens and gang press machines.

Other Semiconductor Fabrication Equipment
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  • Semiconductor System Business
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