Semiconductor-related Products
Open

Clip Bonder
BESTEM-C310

Clip Bonder BESTEM-C310
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-C310

Clip bonder for clip bonding packages with compatibility, such as SOT, SOP and QFN.

Features

1.Best TCO
High throughput, small footprint, shortening device conversion time, multi-dispense head.

2.Best Quality
Bonding accuracy XY: ± 50 µm, 3 σ
Solder paste oxidization prevention.

3.Compatible with Dpak, SOP, SON, QFN and other power devices.

4.Profiling function realizes optimum temperature management

5.Various handling
Clip size □1.0 mm or above.

Main Specs

Bonding Method
Paste, solder
Cycle Time
1.0sec/cycle
Bonding Accuracy
XY : ±50μm,3σ
Lead Frame Size
Length : 150–300 mm
Width : 25–102 mm
Pitch : 3–55 mm
Thickness : 0.075–0.6 mm
Clip (Hoop Frame)
Width : 9–60 mm
Pitch : 2.5–50 mm
Thickness : 0.1–0.3 mm
Clip size : □1.0 mm or higher
Strip frame length : 170–280 mm
Pellet (Bonded Chip)
X, Y : □0.8–□10.0 mm
Thickness : 0.1–1.0 mm
Power requirements
Power supply : AC 200 V 30 A
Dry air : 0.4 MPa (60 L/min)
Vacuum : -66.7 KPa (100 L/min)
Dimensions
(W) 2,557 × (D) 1,473 × (H) 2,045 mm
(Including connection rail / duct hose, without signal tower)
Weight
Approximately 1,400 kg