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Clip BonderBESTEM-C310
- Overview
- Specifications
Basic Information
Model name : BESTEM-C310
Clip bonder with dispenser for clip bonding packages.
Features
1. Equipped with an individual clip vacuum pickup function to reduce the number of defective clips
2. Equipped with a chip/clip position detection function to improve accuracy
3. Supports the use of both a hoop reel supply and bulk supply (optional) for clips
4. Realizes in-line connection of the die bonder and the curing furnace
Main Specs
- Bonding Method
- Epoxy bonding
- Coating unit
- Triple-dispenser method
- Bonding Speed
-
1.2sec/cycle
*Not including processing time
- Bonding Accuracy
-
XY: ±68 μm ≦ 4 σ
θ: ±4° ≦ 4 σ
*Measurement before curing
- Die Size
-
X,Y: □0.8-□10.0 mm
t: 0.1-1.0 mm
- Lead frame size
(substrate size) -
Length: 150-300 mm
Width: 25-102 mm
Pitch: 3-25 mm
Thickness: 0.075-0.6 mm
- Power requirements
-
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7kPa (100L/min)
Power consumption: 6.0KVA
Emission: φ100 mm, φ32 mm duct hose (for dust collection)
- Dimensions
-
(W) 2,557 × (D) 1,473 × (H) 2,045 mm
(including connecting rail, not including signal tower)
- Weight
- Approximately 1,400 kg
- Clip frame size
-
Width: 9-60 mm
Thickness: 0.1-0.3 mm
Pitch: 2.5-50 mm
Clip size: □1.0 mm or more
Strip frame length: 170-280 mm
Strip frame width: 35-60 mm
Options
- Optional Functions
-
1. Support for in-line use
2. Support for strip clip frame supply
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.