Clip Bonder
BESTEM-C310

Overview
Specifications

Basic Information

Model name : BESTEM-C310

Clip bonder with dispenser for clip bonding packages.

Features

1. Equipped with an individual clip vacuum pickup function to reduce the number of defective clips

2. Equipped with a chip/clip position detection function to improve accuracy

3. Supports the use of both a hoop reel supply and bulk supply (optional) for clips

4. Realizes in-line connection of the die bonder and the curing furnace

Main Specs

Bonding Method: Epoxy bonding

Coating unit: Triple-dispenser method

Bonding Speed: 1.2sec/cycle
*Not including processing time

Bonding Accuracy: XY: ±68 μm ≦ 4 σ
θ: ±4° ≦ 4 σ
*Measurement before curing

Die Size: X,Y: □0.8-□10.0 mm
t: 0.1-1.0 mm

Lead frame size (substrate size): Length: 150-300 mm
Width: 25-102 mm
Pitch: 3-25 mm
Thickness: 0.075-0.6 mm

Power requirements: Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7kPa (100L/min)
Power consumption: 6.0KVA
Emission: φ100 mm, φ32 mm duct hose (for dust collection)

Dimensions: (W) 2,557 × (D) 1,473 × (H) 2,045 mm
(including connecting rail, not including signal tower)

Weight: Approximately 1,400 kg

Clip frame size: Width: 9-60 mm
Thickness: 0.1-0.3 mm
Pitch: 2.5-50 mm
Clip size: □1.0 mm or more
Strip frame length: 170-280 mm
Strip frame width: 35-60 mm

Options

Optional Functions: 1. Support for in-line use
2. Support for strip clip frame supply

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.

Clip BonderBESTEM-C310