Die Sorter

BESTEM‐S500

Basic Information

Model name : BESTEM-S500

This machine picks up only quality die from diced wafers,
A die sorter that is aligned and stored in the tray.

Features

1. Extensive experience supporting from MEMS to IGBT and CMOS sensors

2.Best Quality - High accuracy XY: 38 μm (3 σ) -

3. Compatible with 6, 8 and 12 inch wafers with change kit

4. Supports thin die with proprietary needleless pickup technology (Options)

Main specs