Solder bonding die bonder for high heat capacity devices

Needleless Pickup Unit

Basic Information

This unit enables the high-speed pickup of ultra-thin chips without causing damage and can easily pick up dies with a thickness of 40 µm or less, which is generally thought to be impossible using the conventional ejector needle method. It can be mounted on die bonder and die sorter machines made by Canon Machinery.

Features

1. High-speed pickup of thin chips

2. Damage to chips is reduced because an ejector needle is not used for chip peeling

3. Fully compatible with our standard ejector needle unit (shorter unit replacement time)

Main Specs

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.