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8 inch (300) Series Platform

8 inch (300) Series Platform8 inch (300) Series Platform

Platform/Modularized image

BESTEM Series Product Lineup

Epoxy die bonder

Small die, paste bonding, twin dispensing system

IC, Sensor / QFN, CSP

Epoxy die bonder

Small die, paste bonding, twin stamping system

LED / PLCC, LGA

Soft solder die bonder

Soft solder bonding, wire direct system

Power Device, IGBT / To-220, To-3P

Clip bonder

Clip bonding

Power Device, MOSFET / DFN, SON, PQFN

Die sorter

Die sorting

Bare Si, Glass, Mold PKG / To Tray, To Ring

For Maintenance and Support Information

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Contact us

About Semiconductor-related ProductsCLICK HERE FOR DETAILS

About Semiconductor-related Products

For Products Information

Semicon System Business Headquarters
Sales Div.

Phone:
(81)77-566-1822
Fax:
(81)77-566-1833
Hours
Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00

For Maintenance and support Information

Customer Service Dept.

Phone:
(81)77-566-1831
Fax:
(81)77-566-1832
Hours
Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00