Vision
This section introduces Canon Machinery’s corporate philosophy and its vision for continuing to shine in the 21st century.

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- President’s Message
- Corporate Philosophy ＆ Management Philosophy

Our Business
Here we introduce Canon Machinery’s areas of business: the Factory Automation System Business, the Semiconductor System Business, New Fields and Research and Development.

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Newsroom
Here, we provide the latest news about Canon Machinery.

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- August 7, 2024 Discontinued Parts for Maintenance Service
- July 31, 2023 Notice of Summer Closure
- March 21, 2024 Discontinued Parts for Maintenance Service
- December 21, 2023 Notice of Year-End and New Year's Holidays Closure
- July 31, 2023 Notice of Summer Holidays 2023
- September 12, 2022 Notification Regarding Discontinuation of Maintenance Support ≪Affected equipment: CPS/CAP series≫

About Canon Machinery
In addition to corporate information on Canon Machinery, this section provides technology, product and introduces CSR activities.

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- Corporate Info
- Corporate Profile
- Canon Machinery Operations
- Technology
- Machinery Movie
- Official Social Media Account Lists
- Product Information
- CSR Activities
- Environmental Initiatives
- Quality and Safety Initiatives
- Risk Management
- Social Contribution Activities

Product Information

Product Information
For Semiconductor-related Products
- Back
- For Semiconductor-related Products
- 8 inch (300) Series Platform
- 12 inch (500) Series Platform
- Inspection equipment
  - Back
  - BESTEM-V110
- Inline curing oven
  - Back
  - BCOS-Ⅵ
For Electronic Components-related Products
- Back
- For Electronic Components-related Products
- Substrate coining device
- Substrate cutting device
  - Back
  - SDM-300T
For Maintenance and Support Information

8 inch (300) Series Platform

8 inch (300) Series Platform

8 inch (300) Series Platform

Platform

BESTEM Series Product Lineup

Epoxy die bonder

Small die, paste bonding, twin dispensing system

IC, Sensor / QFN, CSP

BESTEM‐D310

BESTEM‐D311plus

Epoxy die bonder

Small die, paste bonding, twin stamping system

LED / PLCC, LGA

BESTEM‐D320

Soft solder die bonder

Soft solder bonding, wire direct system

Power Device, IGBT / To-220, To-3P

BESTEM‐D340

Clip bonder

Clip bonding

Power Device, MOSFET / DFN, SON, PQFN

BESTEM‐C310

Die sorter

Die sorting

Bare Si, Glass, Mold PKG / To Tray, To Ring

BESTEM‐S300

Needleless pickup unit

For Maintenance and Support Information

CLICK HERE FOR DETAILS

Contact us

About Semiconductor-related ProductsCLICK　HERE FOR DETAILS

About Semiconductor-related Products

For Products Information

Semicon System Business Headquarters
Sales Div.

Phone:: (81)77-566-1822
Fax:: (81)77-566-1833
Hours: Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00

For Maintenance and support Information

Customer Service Dept.

Phone:: (81)77-566-1831
Fax:: (81)77-566-1832
Hours: Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00