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Soft Solder Die BonderBESTEM-D540
- Overview
- Specifications
Basic Information
Model name : BESTEM-D540
Die bonder for soft solder die attach processes for power devices that require high bonding quality, from power discretes to power ICs and IGBT modules, including automotive applications.
Features
1. Stable bonding quality realized by a high-performance reducing feeder
2. Solder supply stabilized by adoption of a new solder supply nozzle
3. Equipped with a newly developed digital spanking function to shorten the adjustment time
4. Compatible with up to 12-inch wafers
Main Specs
- Bonding Method
- Wire solder supply joining
- Coating unit
- Solder supply unit
- Bonding Speed
-
0.6sec/cycle
* SOP8-series matrix/chip size equivalent to □3 mm
Not including processing time
- Bonding Accuracy
-
XY: ±38 µm (3 σ)
Θ: ±1° (3 σ)
*Cu island, spanker & pyramid collet
- Die Size
-
□0.5～□11mm
t：0.1~0.5㎜
- Lead frame size
(substrate size) -
Length: 110-260 mm (as an option, supports up to 300 mm)
Width: 10-100 mm
Thickness: 0.1-2.0 mm
- Wafer Size
- Max φ12 inch
- Power requirements
-
Power requirements: AC200V 30A /heater power source AC200V 40A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7kPa (100L/min)
N2: 0.2Mpa (40L/min or above)
Mixed gas (H2+N2): 0.2Mpa (50-100L)
- Dimensions
-
(W) 2,205 × (D) 1,415 × (H) 1,708mm
(without signal tower when front cover is closed)
- Weight
- Approximately 2,000 kg
Options
- Optional Functions
-
1. Support for collet heaters
2. Support for collet rotators
3. Wafer mapping
4. Traceability
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.