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Soft Solder Die Bonder
BESTEM-D540

Soft Solder Die Bonder BESTEM-D540
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-D540

Die bonder for soft solder die attach processes for power devices that require high bonding quality, from power discretes to power ICs and IGBT modules, including automotive applications.

Features

1. Stable bonding quality realized by a high-performance reducing feeder

2. Solder supply stabilized by adoption of a new solder supply nozzle

3. Equipped with a newly developed digital spanking function to shorten the adjustment time

4. Compatible with up to 12-inch wafers

Main Specs

Bonding Method
Wire solder supply joining
Coating unit
Solder supply unit
Bonding Speed
0.6sec/cycle
* SOP8-series matrix/chip size equivalent to □3 mm
Not including processing time
Bonding Accuracy
XY: ±38 µm (3 σ)
Θ: ±1° (3 σ)
*Cu island, spanker & pyramid collet
Die Size
□0.5～□11mm
t：0.1~0.5㎜
Lead frame size
(substrate size)
Length: 110-260 mm (as an option, supports up to 300 mm)
Width: 10-100 mm
Thickness: 0.1-2.0 mm
Wafer Size
Max φ12 inch
Power requirements
Power requirements: AC200V 30A /heater power source AC200V 40A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7KPa (100L/min)
N2: 0.2Mpa (40L/min or above)
Mixed gas (H2+N2): 0.2Mpa (50-100L)
Dimensions
(W) 2,205 × (D) 1,415 × (H) 1,708mm
(without signal tower when front cover is closed)
Weight
Approximately 2,000 kg

Options

Optional Functions
1. Support for collet heaters
2. Support for collet rotators
3. Wafer mapping
4. Traceability

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.