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12 inch (500) Series Platform

12 inch (500) Series Platform12インチ(500)系プラットフォーム

Platform/Modularized image

BESTEM Series Product Lineup

Epoxy Die Bonder

Paste bonding, DAF bonding, twin dispensing system

Multi-pin IC / QFN, CSP

Epoxy high-accuracy die bonder

Large die high accuracy, paste bonding, DAF bonding, twin dispensing system

Multi-pin IC / BGA, QFN

Epoxy flip chip bonder

Flip chip bonding

IC, Discrete / QFN

DAF high-accuracy die bonder

Thin die, high accuracy, DAF bonding

NAND Flash / Stacking PKG

Soft solder die bonder

Soft solder bonding, wire direct system

Power Device, IGBT / To-220, To-3P

For Maintenance and Support Information

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Contact us

About Semiconductor-related ProductsCLICK HERE FOR DETAILS

About Semiconductor-related Products

For Products Information

Semicon System Business Headquarters
Sales Div.

Phone:
(81)77-566-1822
Fax:
(81)77-566-1833
Hours
Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00

For Maintenance and Support Information

Customer Service Dept.

Phone:
(81)77-566-1831
Fax:
(81)77-566-1832
Hours
Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00