Vision
This section introduces Canon Machinery’s corporate philosophy and its vision for continuing to shine in the 21st century.

LEARN MORE
- President’s Message
- Corporate Philosophy ＆ Management Philosophy

Our Business
Here we introduce Canon Machinery’s areas of business: the Factory Automation System Business, the Semiconductor System Business, New Fields and Research and Development.

LEARN MORE

Newsroom
Here, we provide the latest news about Canon Machinery.

LEARN MORE
- August 7, 2024 Discontinued Parts for Maintenance Service
- July 31, 2023 Notice of Summer Closure
- March 21, 2024 Discontinued Parts for Maintenance Service
- December 21, 2023 Notice of Year-End and New Year's Holidays Closure
- July 31, 2023 Notice of Summer Holidays 2023
- September 12, 2022 Notification Regarding Discontinuation of Maintenance Support ≪Affected equipment: CPS/CAP series≫

About Canon Machinery
In addition to corporate information on Canon Machinery, this section provides technology, product and introduces CSR activities.

LEARN MORE
- Corporate Info
- Corporate Profile
- Canon Machinery Operations
- Technology
- Machinery Movie
- Official Social Media Account Lists
- Product Information
- CSR Activities
- Environmental Initiatives
- Quality and Safety Initiatives
- Risk Management
- Social Contribution Activities

Product Information

Product Information
For Semiconductor-related Products
- Back
- For Semiconductor-related Products
- 8 inch (300) Series Platform
- 12 inch (500) Series Platform
- Inspection equipment
  - Back
  - BESTEM-V110
- Inline curing oven
  - Back
  - BCOS-Ⅵ
For Electronic Components-related Products
- Back
- For Electronic Components-related Products
- Substrate coining device
- Substrate cutting device
  - Back
  - SDM-300T
For Maintenance and Support Information

12 inch (500) Series Platform

12 inch (500) Series Platform

12 inch (500) Series Platform

Platform

BESTEM Series Product Lineup

Epoxy Die Bonder

Paste bonding, DAF bonding, twin dispensing system

Multi-pin IC / QFN, CSP

BESTEM‐D510

Epoxy high-accuracy die bonder

Large die high accuracy, paste bonding, DAF bonding, Single dispensing system

Multi-pin IC / BGA, QFN

BESTEM‐D511plus

Epoxy flip chip bonder

Flip chip bonding

IC, Discrete / QFN

BESTEM‐D511f plus

Soft solder die bonder

Soft solder bonding, wire direct system

Power Device, IGBT / To-220, To-3P

BESTEM‐D540

DAF high-accuracy die bonder

Thin die, high accuracy, DAF bonding

NAND Flash / Stacking PKG

BESTEM‐D631

Die sorter

Die sorting

Bare Si, Glass, Mold PKG / To Tray, To Ring

BESTEM-S500

Needleless pickup unit

For Maintenance and Support Information

CLICK HERE FOR DETAILS

Contact us

About Semiconductor-related ProductsCLICK　HERE FOR DETAILS

About Semiconductor-related Products

For Products Information

Semicon System Business Headquarters
Sales Div.

Phone:: (81)77-566-1822
Fax:: (81)77-566-1833
Hours: Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00

For Maintenance and Support Information

Customer Service Dept.

Phone:: (81)77-566-1831
Fax:: (81)77-566-1832
Hours: Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00