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50th Canon Machinery since1972
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  • Vision

    This section introduces Canon Machinery’s corporate philosophy and its vision for continuing to shine in the 21st century.

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    • President’s Message
    • Corporate Philosophy & Management Philosophy
  • Our Business

    Here we introduce Canon Machinery’s areas of business: the Factory Automation System Business, the Semiconductor System Business, New Fields and Research and Development.

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    • Business Overview
    • Factory Automation System Business
    • Semiconductor System Business
  • Newsroom

    Here, we provide the latest news about Canon Machinery.

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    • April 23, 2025 Notice of Golden Week Holiday Closure
    • April 1, 2025 Notice Change of Representative Directors and Officers
    • December 17, 2024 Notice of Year-End and New Year's Holidays Closure
    • November 5, 2024 Notice regarding liquidation of subsidiary
    • August 7, 2024 Discontinued Parts for Maintenance Service
    • July 31, 2023 Notice of Summer Closure
  • About Canon Machinery

    In addition to corporate information on Canon Machinery, this section provides technology, product and introduces CSR activities.

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    • Corporate Info
    • Corporate Profile
    • Canon Machinery Operations
    • Technology
    • Machinery Movie
    • Official Social Media Account Lists
    • Product Information
    • CSR Activities
    • Environmental Initiatives
    • Quality and Safety Initiatives
    • Risk Management
    • Social Contribution Activities
  • TOP
  • Vision
    • Back
    • Vision
    • President’s Message
    • Corporate Philosophy & Management Philosophy
  • Our Business
    • Back
    • Our Business
    • Business Overview
    • Factory Automation System Business
    • Semiconductor System Business
  • Newsroom
  • About Canon Machinery
    • Back
    • About Canon Machinery
    • Corporate Info
      • Back
      • Corporate Profile
      • Canon Machinery Operations
    • Technology
      • Back
      • Technology
      • Unique Technology presently supporting Canon Machinery
    • Machinery Movie
    • Official Social Media Account Lists
    • Product Information
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      • Product Information
      • Semiconductor-related Products
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        • Semiconductor-related Products
        • 8-Inch Series Platform
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          • 8-Inch Series Platform
          • BESTEM-D310/D311plus
          • BESTEM-D320
          • BESTEM-D340
          • BESTEM-C310
          • BESTEM-S300
          • Needleless Pickup Unit
        • 12-Inch Series Platform
          • Back
          • 12-Inch Series Platform
          • BESTEM-D610
          • BESTEM-D511 plus
          • BESTEM-D511fplus
          • BESTEM-D540
          • BESTEM-D631
          • BESTEM-S500
          • Needleless Pickup Unit
        • Inspection System
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          • BESTEM-V110
        • In Line Curing Oven
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          • BCOS-Ⅵ
      • Electronic Components-related Products
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        • Electronic Components-related Products
        • Substrate coining device
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          • HPM-44000
          • HPM-13000A
        • Substrate cutting device
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          • SDM-300T
      • Maintenance and Support Information
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        • Maintenance and Support Information
        • For Discontinued and Replacement Prats
    • CSR Activities
      • Back
      • Environmental Initiatives
      • Quality and Safety Initiatives
      • Risk Management
      • Social Contribution Activities
  • Maintenance and Support Information
  • Contact Us
Product Information
Open
  • Product Information
  • For Semiconductor-related Products
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    • For Semiconductor-related Products
    • 8 inch Series Platform
      • Back
      • 8 inch Series Platform
      • BESTEM-D310/D311plus
      • BESTEM-D320
      • BESTEM-D340
      • BESTEM-C310
      • BESTEM-S300
      • Needleless Pickup Unit
    • 12 inch Series Platform
      • Back
      • 12 inch Series Platform
      • BESTEM-D610
      • BESTEM-D511 plus
      • BESTEM-D511fplus
      • BESTEM-D540
      • BESTEM-D631
      • BESTEM-S500
      • Needleless Pickup Unit
    • Inspection equipment
      • Back
      • BESTEM-V110
    • Inline curing oven
      • Back
      • BCOS-Ⅵ
  • For Electronic Components-related Products
    • Back
    • For Electronic Components-related Products
    • Substrate coining device
      • Back
      • HPM-44000
      • HPM-13000A
    • Substrate cutting device
      • Back
      • SDM-300T
  • For Maintenance and Support Information
    • Back
    • For Maintenance and Support Information
    • For Discontinued and Replacement Prats

12 inch Series Platform

12 inch Series Platform12 inch Series Platform

BESTEM Series Product Lineup

Epoxy Die Bonder

Paste bonding, DAF bonding, twin dispensing system

Multi-pin IC / QFN, CSP

BESTEM‐D610

Epoxy high-accuracy die bonder

Large die high accuracy, paste bonding, DAF bonding, Single dispensing system

Multi-pin IC / BGA, QFN

BESTEM‐D511plus

Epoxy flip chip bonder

Flip chip bonding

IC, Discrete / QFN

BESTEM‐D511f plus

Soft solder die bonder

Soft solder bonding, wire direct system

Power Device, IGBT / To-220, To-3P

BESTEM‐D540

DAF high-accuracy die bonder

Thin die, high accuracy, DAF bonding

NAND Flash / Stacking PKG

BESTEM‐D631

Die sorter

Die sorting

Bare Si, Glass, Mold PKG / To Tray, To Ring

BESTEM-S500

Needleless pickup unit

For Maintenance and Support Information

CLICK HERE FOR DETAILS

Contact us

About Semiconductor-related ProductsCLICK HERE FOR DETAILS

About Semiconductor-related Products

For Products Information

Semicon System Business Headquarters
Sales Div.

Phone:
(81)77-566-1822
Fax:
(81)77-566-1833
Hours
Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00

For Maintenance and Support Information

Customer Service Dept.

Phone:
(81)77-566-1831
Fax:
(81)77-566-1832
Hours
Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00
  • TOP
  • About Canon Machinery
  • Product Information
  • Semiconductor-related Products
  • 12 inch Series Platform
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