BESTEM-V110

Basic Information

Model name: BESTEM-V110

This model is 3D AOI machine to achieve more automated and efficient inspection required by Wire bonding process.

Features

1.High Performance 3D Measurement
Equipped with 3D measurement function utilizing the focal point method. Compared to other 3D measurement methods, this method is distinctive for its strength in measuring inclined surfaces and microstructures, facilitating appearance inspections with fewer false positives.

2.Highly Reliable Inspections via Dimension Measurements
Capable of measuring various dimensions, such as the apex of wire height and bond width. A standard range is set for the dimensions of each part, facilitating rejections when dimensions falls outside the specified range.

3.Traceability Support
Measurement results can be saved internally and then output externally.
By analyzing the result of each measurement, it is possible to apprehend assembly variations and trends useful for improving the upstream process.

4.Easy Operation
Inspections are easily conducted by simply selecting the name of the product to be inspected and indicating inspection start. Automatic supply and discharge of materials is possible via the loader/unloader.

Main Specs

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.