BESTEM-V110

Basic Information

Model name: BESTEM-V110

This appearance inspection system facilitates automated and efficient inspections required during the wire bonding process.

Features

1.High Performance 3D Measurement
Equipped with 3D measurement function utilizing the focal point method. Compared to other 3D measurement methods, this method is distinctive for its strength in measuring inclined surfaces and microstructures, facilitating appearance inspections with fewer false positives.

2.Highly Reliable Inspections via Dimension Measurements
Enables the measurement of approximately 20 types of dimensions, such as the apex of wire height and bond width. A standard range is set for the dimensions of each part, facilitating rejections when dimensions falls outside the specified range.

3.Traceability Support
Enables the creation of a traceability environment by reading the 2D code marked on the material and sending it to the host server together with the inspection results. By analyzing the result of each measurement, it is possible to apprehend assembly variations and trends useful for improving the upstream process.

4.Easy Operation
Inspections are easily conducted by simply selecting the name of the product to be inspected and indicating inspection start. Automatic supply and discharge of materials is possible via the loader/unloader.

Main Specs

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.