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Epoxy Die Bonder
BESTEM-D510

Epoxy Die Bonder BESTEM-D510
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-D510

Twin-dispenser die bonder for 12-inch wafer IC·LSI

Features

1. Equipped with a twin-dispenser system to improve productivity

2. Achieves high quality by minimizing the distance between bond application and chip mounting to suppress changes in the adhesive over time

3. Equipped with wizard functionality to realize excellent operability

4. Equipped with a needless pickup unit (optional) for compatibility with thin chips

Main Specs

Bonding Method
Epoxy bonding/thermal compression bonding (OP)
Coating unit
Twin-dispenser method
Bonding Speed
0.257sec/cycle (□0.5 mm -1.0 mm)
*Not including processing time
Bonding Accuracy
XY: ±25 μm, 3 σ
θ: ±1°, 3 σ (□1.0 mm or above)
θ: ±3°, 3 σ (Less than □1.0 mm)
Die Size
□0.3-□8.0 mm
t: 0.075-0.5 mm
Option: □0.15-2.0 mm
Lead frame size
(substrate size)
Length: 100-300 mm
Width: 25-102 mm
Thickness: 0.075-2.0 mm
Down set height 0-1.0 mm
Up set height 0-0.3 mm
Wafer Size
Max φ12 inch
Power requirements
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7KPa (100L/min)
Dimensions
(W) 1,900 × (D) 1,400 × (H) 1,600mm
(without signal tower when front cover is closed)
Weight
Approximately 1,600 kg

Options

Optional Functions
1. Supports mounted heater (max 200℃-1 CH)
2. Needleless pickup
3. Wafer mapping
4. Traceability

*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.