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Epoxy Die BonderBESTEM-D510
- Overview
- Specifications
Basic Information
Model name : BESTEM-D510
Twin-dispenser die bonder for 12-inch wafer IC·LSI
Features
1. Equipped with a twin-dispenser system to improve productivity
2. Achieves high quality by minimizing the distance between bond application and chip mounting to suppress changes in the adhesive over time
3. Equipped with wizard functionality to realize excellent operability
4. Equipped with a needless pickup unit (optional) for compatibility with thin chips
Main Specs
- Bonding Method
- Epoxy bonding/thermal compression bonding (OP)
- Coating unit
- Twin-dispenser method
- Bonding Speed
-
0.257sec/cycle (□0.5 mm -1.0 mm)
*Not including processing time
- Bonding Accuracy
-
XY: ±25 μm, 3 σ
θ: ±1°, 3 σ (□1.0 mm or above)
θ: ±3°, 3 σ (Less than □1.0 mm)
- Die Size
-
□0.3-□8.0 mm
t: 0.075-0.5 mm
Option: □0.15-2.0 mm
- Lead frame size
(substrate size) -
Length: 100-300 mm
Width: 25-102 mm
Thickness: 0.075-2.0 mm
Down set height 0-1.0 mm
Up set height 0-0.3 mm
- Wafer Size
- Max φ12 inch
- Power requirements
-
Power requirements: AC200V 30A
Dry air: 0.4MPa (60L/min)
Vacuum source: -66.7KPa (100L/min)
- Dimensions
-
(W) 1,900 × (D) 1,400 × (H) 1,600mm
(without signal tower when front cover is closed)
- Weight
- Approximately 1,600 kg
Options
- Optional Functions
-
1. Supports mounted heater (max 200℃-1 CH)
2. Needleless pickup
3. Wafer mapping
4. Traceability
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.