Epoxy Die Bonder

Epoxy Die Bonder BESTEM-D510
  • Overview
  • Specifications

Basic Information

Model name : BESTEM-D510

High-speed, high-accuracy die bonder for IC and LSI compatible with 12 inch wafers.


1.Reduced TCO with high throughput, small footprint and minimized conversion time.

2.Easier adjustment, equipped with rework function realizing excellent operability.

3.Minimizes distance between mount and preform, prevents changes over time and reduces wasted movements.

4.Equipped with newly developed twin dispensing system compatible with various pastes.

5.Needleless pickup system (optional) realizes pickups with no damage.

Main Specs

Bonding Method
Epoxy bonding / thermo-compression bonding (optional)
Bonding Speed
Bonding Accuracy
XY: ± 25 μm. 3σ
θ: 1°, 3σ (□1.0 mm or above)
θ: 3°, 3σ (below □1.0 mm)
Die Size
□0.3–□8.0 mm t = 0.075–0.5 mm
Optional : □0.15–□2.0 mm (recognition lens conversions)
Lead Frame Size
Length : 100–300 mm
Width : 25–102 mm
Thickness : 0.075–2.0 mm
Magazine Size
Length : 100–315 mm
Width : 35–115 mm
Thickness : 50–200 mm
Pitch : 3mm–
Wafer Size
Max φ12 inch
Power requirements
Power supply : AC 200 V 30 A
Dry air : 0.4 MPa (60 L/min)
Vacuum : -66.7 KPa (100 L/min)
(W) 1,930 × (D) 1,400 × (H) 1,600 mm
(without signal tower when front cover is closed)
Approximately 1,600 kg


Optional Functions
Magazine stacker loader
Mount heater corresponding (Max 200°C-1ch)
Ionizer blower
Needleless pickup unit
Wafer mapping