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Substrate Coining Machine
HPM-44000

Substrate Coining Machine HPM-44000
  • Overview
  • Specifications

Basic Information

Model name : HPM-44000

This machine takes out individual substrates supplied from a tray one at a time, positions them with a special jig, and flattens the C4 bumps on the substrates with high accuracy by pressing them one at a time with four independent upper and lower heads.
A similar model also enables substrates arranged in a tray to be processed by moving the entire tray on an XY table.

Features

1. Accurate processing realized by the adoption of a high-accuracy servo press (pressure range 300–50,000 N)

2. The upper and lower head are equipped with an automatic leveling function (automatic parallelism adjustment) to shorten the product change time.

3. High productivity realized with four independent processing axes.

4. Twin table mechanism that significantly reduces the workpiece replacement time (no production loss).

5. Equipped with a function for real-time graphical display of load and displacement.

6. Tool-less replacement of head tools with one-touch attachment and detachment.

Target Products

IC package substrates (FC-BGA, FC-CSP)

IGBT packages (Ag sinter)

Other electronic substrates

Main Specs

Axis
4axis
Capability ★
UPH = 4400 (tray arrangement 5 × 12; Press time:1sec)
Pressure Range
Standard: 300 N–40,000 N (option: MAX50,000N)
Pressure Accuracy
Set value ±1.5%(It varies depending on the conditions)
Head Temp Range
Normal temperature +20℃–200℃
Head Temp Accuracy
Set value ±3%（under70℃ will be±3℃）
Substrate size
Be within the JEDEC tray
Head size
Standard: □10 × 10 mm–□90 × 90 mm (option: □110 × 110 mm)
Press Table
twinXYZtable(servo)

★ This data is for reference values, and will change depending on conditions.