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Substrate Cutting MachineSDM-300T
- Overview
- Specifications
Basic Information
Model name : SDM-300T
This machine fixes material supplied from the magazine on direct adsorption plate and cuts it to prescribed dimensions with high precision. After cutting, the material is removed in bulk with a suction pad, drained after pre-cleaning and stored in the JEDEC tray. Capable to support in-line connection to Washing process machine and Inspection machine.
Features
1.Equipped with twin spindles in pursuit of throughput.
2.Employs high-output air spindles compatible with high loads.
3.Four-point conversion kit makes conversion simple.
4.Equipped with rotating stage that freely allocates storage in the JEDEC tray.
5.Waste material and underside pre-wash are processed simultaneously in one position.
Target Products
IC package substrate (FC-BGA)
Other electronic substrates
Main Specs
- Applicable Products
-
Size : Max □300 × 300 mm Thickness : 0.5–2mm
※Max □600 × 600 mm (devices compatible with larger formats also available)
- Process Head
-
Output motor: 3.0 kW air spindle
Cutter rotations: 30,000 rpm
- Dimensions
- (L) 3,200 × (W) 1,900 × (H) 1,750 mm
- Power requirements
- AC 200V ± 10% 15 kVA or higher
- Compressed air requirements
- 0.5 Mpa (4,500N liter/min)
- Water requirements
- 0.3 Mpa (15N liter/min)
- Noise
- 80 db or less (A scale measurement)