Die SorterBESTEM-S300
- Overview
- Specifications
Basic Information
Model name : BESTEM-S300
This machine picks up only quality die from diced wafers, organizes and stores them on the tray. Equipped with full digital control bonding head with high-speed potential, records location data for each unit based on work data, various teaching functions and HMI bonding facilitate high productivity, ease of adjustment, stability and flexibility
Features
1.Best TCO - High UPH, Small footprint, shortening device conversion time -
2.Best Quality - High accuracy XY: 38 μm (3 σ) -
3.Compatible with fragile devices - IR cut filters, thin die, etc. -
4.Defective chip inspection - Equipped with backside inspection function -
5.Flexible die pickup capability - Corresponding to □1.0–12.5 mm -
Main Specs
- Target Device
- Silicon, glass
- Cycle Time
- 0.38sec/cycle
- Array Accuracy
- XY:38µm,3σ
- Die Size
- □1.0-□12.5 mm t=0.1-1.0mm
- Transportable Tray Size
- 2/3/4 inch
- Transportable Tray Thickness
- 2-8mm
- Ring Size
- Max 8 inch
- Tray Size Conversion Time
- Approximately 12 minutes
- Tray Stock Height
- Max 250 mm
- Loader
- Tray stacking system
- Unloader
- Pallet system
- Recognition System
- Pocket recognition function (CMOS camera)
- Inspection Function
- Function to visual inspection before pickup (optional)
- Power Requirement
-
Power supply : AC 200 V 20 A
Dry air : 0.4 MPa (60 L/min)
Vacuum : -66.7 KPa (100 L/min)
- Weight
- Approximately 1,200 kg