Epoxy Die BonderBESTEM-D310
- Overview
- Specifications
Basic Information
Model name : BESTEM-D310
High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
Features
1.Best TCO
Small footprint, shorter product switching time
2.Best Quality
Quick-drying paste compatibility.
3. Wide range of lead frame compatibility
Lead frame size: W 102 mm × L 300 mm.
4.Equipped with newly developed twin dispensing system
Compatible with a variety of pastes, stable application performance.
5.High-accuracy small die pickup
□0.15–8.0 mm compatibility.
Main Specs
- Bonding Method
- Epoxy bonding
- Bonding Speed
- 0.165sec/cycle
- Bonding Accuracy
-
XY : ±25μm,3σ
θ : ±1°,3σ(□1.0mm or above)
θ : ±3°,3σ(under □1.0mm)
- Die Size
-
□0.3-□8.0mm t=0.1-0.5mm
Option : □0.15-□2.0mm
- Lead frame Size
-
Length : 50-260mm(up to 300 mm in option)
Width : 20-102mm
Thickness : 0.1-1.0mm
- Magazine Size
-
Length : 50-260mm(up to 300 mm in option)
Width : 20-110mm
Thickness : 50-200mm
Pitch : 3mm-
- Wafer Size
- Max φ8 inch
- Power requirements
-
Power supply: AC 200 V / 20 A
Dry air: 0.4 MPa (60 L/min)
Vacuum: -66.7 KPa (100 L/min)
- Dimensions
-
(W) 1,600 × (D) 1,130 × (H) 1,630mm
(without signal tower when front cover is closed)
- Weight
- Approximately 1,200 kg
Options
- Optional Functions
-
Magazine stacker loader
Ionizer blower
Needleless pickup
Wafer mapping