DAF High-Accuracy Die BonderBESTEM‐D531t
- Overview
- Specifications
Basic Information
Model name : BESTEM‐D531t
High-accuracy die bonder for NAND flash compatible with 12 inch wafers.
Features
1.Easy to adjust needleless pickup system able to pick up even ultra-thin die without causing damage, equipped with rework function realizing excellent operability.
2.World’s highest accuracy bonding capability XY: ± 8 μm, θ: ± 0.05° (3σ)
3.Flexible handling, able to handle lead frame sizes of □1.0–25.0 mm and the substrate size of 100–300 mm
Main Specs
- Bonding Method
- thermo-compression (WL-DAF)/Epoxy bonding/DAF tape
- Bonding Speed
- 1.8sec/cycle
- Bonding Accuracy
-
XY : ±8μm,3σ
θ : ±0.05°,3σ
- Die Size
- □1.0-25.0mm t=15μm-
- Substrate Size
-
Length : 100–300 mm
Width : 30–102 mm
- Magazine Size
- Length: 100–315 mm
Width: 30–115 mm
Thickness: 50–200 mm
Pitch: 3mm–
- Wafer Size
- Max φ12 inch
- Power requirements
- Power supply : AC 200 V 30 A
Dry air : 0.5 MPa (60 L/min)
Vacuum : -80 KPa (100 L/min)
- Dimensions
-
(W) 2,160 × (D) 1,470 × (H) 1,600 mm
(Without signal tower when front cover closed)
- Weight
- 1,850kg