Soft Solder Die Bonder BESTEM-D340
- Overview
- Specifications
Basic Information
Model name : BESTEM-D340
This device can be used from power discretes to power ICs and IGBT modules. For power devices that require high bonding quality, including automotive applications Die bonder for solder joining process.
Features
1. High-performance reducing feeder supports solder fusion bonding process
2. High joint quality by adopting solder molding (spanker) function
3. Supports large format frames up to 100 mm wide
Main Specs
- Bonding Method
- Wire solder supply joining
- Bonding Speed
-
UPH : 6000
(SOP 8-series matrix frame, chip size □3 mm equivalent condition)
- Bonding Accuracy
-
Single row frame : XY: ±38 µm (3σ), Θ: ±1° (3σ)
(CuIsland, Spanker & Pyramid Collet)
- Die Size
-
□1-11 mm
Option : 15mm
- Lead frame Size
-
Length : 110-260(up to 300 mm in option)
Width : 10-100 mm
Thickness : 0.1-2.0 mm
- Magazine Size
-
Length : 50-260mm(up to 320 mm in option)
Width : 20-110 mm
Thickness : 50-200 mm
Pitch : 3mm-
- Wafer Size
- Max φ8 inch
- Dimensions
- (W) 1,860 × (D) 1,320 × (H) 1,622mm
- Weight
- Approximately 1,600 kg
Options
- Loader
- Compatible with various frame loaders
- Bonding head part
- Collet heater / collet rotator
- Other
-
Wafer mapping, traceability support
Visual inspection before storing the unloader