Epoxy Die Bonder BESTEM-D320
- Overview
- Specifications
Basic Information
Model name : BESTEM-D320
A LED package compatible die bonder realizing both high performance and reduced total cost of ownership (TCO).
Features
1.Minimizes distance between mount and preform, prevents changes over time and reduces wasted movement.
2.Direct substrate conveyance, work thickness compatible, large substrate compatible (optional), carrier compatible.
3.Applicable to multiple bonding and recognition patterns corresponding to large lighting substrates and modularization.
4.Simplified work data input shortens conversion time to one hour (hardware 15 minutes, set-up 45 minutes).
Main Specs
- Bonding Method
- Epoxy bonding
- Bonding Speed
- 0.165sec/cycle
- Bonding Accuracy
-
XY : ±25μm,3σ
θ : ±3°,3σ
- Die Size
- □0.1-□2.0mm
- Lead frame Size
-
Length : 50–260 mm (up to 300 mm in option)
Width : 20–100 mm
Thickness : 0.1–3 mm
- Wafer Size
- Max φ8 inch
- Power requirements
-
Power supply : AC 200 V 20 A
Dry air : 0.4 MPa (60 L/min)
Vacuum : -66.7 KPa (100 L/min)
- Dimensions
- (W) 1,600 × (D) 1,130 × (H) 1,630 mm
(without signal tower when front cover is closed)
- Weight
- Approximately 1,200 kg
Options
- Optional Functions
- Magazine stacker loader
Ionizer blower
Wafer mapping