12 inch (500) Series Platform
Platform/Modularized image
BESTEM Series Product Lineup
Epoxy Die Bonder
Paste bonding, DAF bonding, twin dispensing system
Multi-pin IC / QFN, CSP
BESTEM‐D510
Epoxy high-accuracy die bonder
Large die high accuracy, paste bonding, DAF bonding, twin dispensing system
Multi-pin IC / BGA, QFN
BESTEM‐D511
DAF high-accuracy die bonder
Thin die, high accuracy, DAF bonding
NAND Flash / Stacking PKG
BESTEM‐D531t
Soft solder die bonder
Soft solder bonding, wire direct system
Power Device, IGBT / To-220, To-3P
BESTEM‐D540
For Maintenance and Support Information
Contact us
About Semiconductor-related ProductsCLICK HERE FOR DETAILS
About Semiconductor-related Products
For Products Information
Semicon System Business Headquarters
Sales Div.
- Phone:
- (81)77-566-1822
- Fax:
- (81)77-566-1833
- Hours
- Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00
For Maintenance and Support Information
Customer Service Dept.
- Phone:
- (81)77-566-1831
- Fax:
- (81)77-566-1832
- Hours
- Monday to Friday (excluding holidays) 9:00-12:00, 13:00-17:00