Die SorterBESTEM‐S500
- Overview
- Specifications
Basic Information
Model name : BESTEM-S500
This machine picks up only quality die from diced wafers,
A die sorter that is aligned and stored in the tray.
Features
1. Extensive experience supporting from MEMS to IGBT and CMOS sensors
2.Best Quality - High accuracy XY: 38 μm (3 σ) -
3. Compatible with 6, 8 and 12 inch wafers with change kit
4. Supports thin die with proprietary needleless pickup technology (Options)
Main specs
- Wafer Size
- □6/8/12 inch
- Die Size
- □1.5 ~ 25 mm
- Transportable Tray Size
- □2/3/4 inch
- Array Accuracy
- XY: ±38 µm (3σ)
- Dimensions
- (W) 2,060 × (D) 1,525 × (H) 1,680mm
- Weight
- Approximately 1,600 kg