Gang Press Machine for LEP/Silver Sintering Process KLIPs-1364s
- Overview
- Specifications
Basic Information
Model name : KLIPs-1364s
A preprocess die bonder is used to press LED chips mounted on substrates using LEP (an anistropic conductive adhesive) while applying heat. It can also be used for the sintered silver crimping process.
Features
1.Employs a highly accurate servo process compatible with a wide range of loads, from 300–30,000N.
2.High productivity is realized by gang pressing large loads.
3.KLIPs are compatible with various products, including ceramic substrates/MCPCB (fully automated) and flexible substrates (semi-automated).
4.Enables the gang pressing of substrates up to 4×6 inches.
5.Equipped with an upper/stage head automatic leveling function resulting in shortening device conversion time.
Main Specs
- Target Device
- LED devices for LEP process
- Press Head
- One axis
- Productivity
- UPH 60,000
- Press Force
- 300-30,000N
- Press Force Accuracy
- Setting value ± 1.5% (for all setting ranges)
- Temperature Range
- Upper head 70–350°C / Stage head 70–250°C
- Temperature Accuracy
- Setting value ± 3%
- Applicable Substrate Size
-
(W) 45-102mm
(L)45-152mm
(t)0.1-3.0mm
- Applicable Magazine Size
-
(W) 50-120mm
(L)90-300mm
(H)50-200mm
- Max Head Dimension
- 102×152mm
- Applicable Buffer Material Film Size
-
(W) 40–100 mm
(outer diameter) –Φ170 mm
- Material Transfer Height
- 903mm±10mm
- Applicable Buffer Material Film Size
-
(W)40-100mm
(outer diameter) –Φ170 mm
- Power requirements
-
Power supply : AC 200V 50/60 Hz 3-phase 30A
Dry air : 0.4 MPa (150 NL/min)
Vacuum : -66.7 kPa
- Dimensions
-
(W)1,100mm
(H)1,900mm (not including signal tower)
- Weight
- Approximately 1,300kg